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  low-power off-line primary side regulation controller ap3768 preliminary datasheet 1 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 0 general description the ap3768 is a high performance ac/dc power sup- ply controller for battery charger and adapter applica- tions. the device uses pulse frequency modulation (pfm) method to build discontinuous conduction mode (dcm) flyback power supplies. the ap3768 provides accurate constant voltage, con- stant current (cv/cc) regulation without requiring an opto-coupler and secondary control circuitry. it also eliminates the need of lo op compensation circuitry while maintaining stability. the ap3768 achieves excellent regulation and high average efficiency, yet meets the requirement for no-load consumption less than 30mw. the ap3768 has the built-in programmable cable volt- age drop compensation function, which make it flexi- ble to accommodate variou s cables with different gauges and lengths. the ap3768 is available in soic-8 package. features primary side control for eliminating opto-cou- pler and secondary cv/cc control circuitry 30mw no-load input power programmable output cable voltage drop com- pensation proprietary cc tightening technique to achieve vertical cc profile compensation for external component tempera- ture variations flyback topology in dcm operation random frequency adjustment to reduce sys- tem emi built-in soft start over voltage protection short circuit protection soic-8 package applications adapter/chargers for cell/cordless phones, pdas, mp3 and other portable apparatus led driver standby and auxiliary power supplies figure 1. package type of ap3768 soic-8
low-power off-line primary side regulation controller ap3768 preliminary datasheet 2 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 0 pin configuration m package (soic-8) pin description pin number pin name function 1 cs the primary current sense 2 vcc supply voltage 3 out this pin drives the base of external power npn switch 4 gnd ground 5 cpc this pin connects a capac itor for output cable compensation 6 fb the voltage feedback from the auxiliary winding 7 cpr connects a resistor to fb pin fo r adjustable output cable compensation 8 bias this pin sets the bias current inside ap3768 with an exte rnal resistor to gnd figure 2. pin configuration of ap3768 (top view) 1 2 3 4 8 7 6 5 cs vcc out gnd cpc fb cpr bias
low-power off-line primary side regulation controller ap3768 preliminary datasheet 3 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 0 functional block diagram figure 3. functional block diagram of ap3768 regulator & bias ovp & ockp pfm tons uvlo comp ea uvlo cv_ ctrl pfm driver r q s r q s tons cc_ctrl fb cs cpc vcc bias out gnd cpr cable compensation constant voltage control peak voltage control & leb constant current control tonsec detector 0.1v v fb 1 2 3 4 57 6 8
low-power off-line primary side regulation controller ap3768 preliminary datasheet 4 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 0 parameter value unit voltage at vcc pin to gnd -0.3 to 36 v voltage at cs, out to gnd -0.3 to 7 v fb input -40 to 10 v output current at out internally limited a operating junction temperature 150 o c storage temperature -65 to 150 o c lead temperature (soldering, 10s) 300 o c thermal resistance junction-to-ambient 190 o c/w esd (machine model) 200 v esd (human body model) 2000 v note 1: stresses greater than those li sted under "absolute maximum ratings" may cause permanen t damage to the device. these are stress ratings only, and functiona l operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. exposure to "absol ute maximum ratings" for extended periods may affect device reliability. absolute maximum ratings (note 1) bcd semiconductor's products, as designa ted with "g1" suffix in the part number, are rohs compliant and green. ordering information circuit type ap3768 - tr: tape and reel package m: soic-8 g1: green package temperature range part number marking id packing type soic-8 -40 to 85 o c AP3768M-G1 3768m-g1 tube ap3768mtr-g1 3768m-g1 tape & reel blank: tube
low-power off-line primary side regulation controller ap3768 5 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 0 preliminary datasheet parameter symbol conditions min typ max unit uvlo section start-up threshold v th (st) 17 18.5 21 v minimal operating voltage v opr (min) 8.2 9.2 10.2 v reference voltage bias pin voltage v bias r bias =200k ? , after turn on 1.0 1.1 1.2 v standby current section start-up current i st v cc =v th (st) -0.5v, r bias =200k ? , before start-up 0.6 a operating current i cc(opr) r bias =200k ? 390 480 a drive output section out maximum current source i out r bias =200k ? 28 36 44 ma current sense section current sense threshold v cs 490 513 535 mv pre-current sense v cs(pre) 390 413 435 mv leading edge blanking 500 ns feedback input section feedback pin input leakage current i fb v fb =4v 1.8 2.4 3.0 a feedback threshold v fb 3.97 4.03 4.09 v enable turn-on voltage v fb(en) -2.0 -1.7 -1.4 v output voltage comp ensation section cpr voltage v cpr dons (tons/t): from 55% to 0.02% 1.5 3.5 v cpr sink current i cpr 200 a protection section over voltage protection v fb(ovp) 789v (v cc =15v, t a =25 o c, unless otherwise specified.) electrical characteristics
low-power off-line primary side regulation controller ap3768 preliminary datasheet 6 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 0 typical performance characteristics -40 -20 0 20 40 60 80 100 120 140 17.0 17.5 18.0 18.5 19.0 19.5 20.0 start-up voltage (v) ambient temperature ( o c) figure 4. start-up voltage vs. ambient temperature -40 -20 0 20 40 60 80 100 120 140 7.5 8.0 8.5 9.0 9.5 10.0 minimal operating voltage (v) ambient temperature( o c) figure 5. minimal operating voltage vs. -40 -20 0 20 40 60 80 100 120 140 300 320 340 360 380 400 420 440 operating current ( a) ambient temperature ( o c) figure 6. operating current vs. ambient temperature -40 -20 0 20 40 60 80 100 120 140 1.00 1.02 1.04 1.06 1.08 1.10 1.12 1.14 1.16 v bias ( v ) ambient temperature ( o c) figure 7. v bias vs. ambient temperature ambient temperature
low-power off-line primary side regulation controller ap3768 preliminary datasheet 7 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 0 typical performance ch aracteristics (continued) 100 200 300 400 500 0 10 20 30 40 50 60 70 source current ( ma ) r bias (k ?) figure 8. source current vs. r bias -40 -20 0 20 40 60 80 100 120 140 0 2 4 6 8 10 i fb ( a) ambient temperature ( o c) figure 9. i fb vs. ambient temperature 160 180 200 220 240 260 280 300 320 340 360 30 35 40 45 50 55 60 65 70 75 minimal frequency (hz) r bias ( ? ) figure 10. minimal frequency vs. r bias
low-power off-line primary side regulation controller ap3768 preliminary datasheet 8 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 0 typical application figure 11. 5v/0.7a output for battery charger of mobile phone + j1 ac 85- 264v c1 r1 + c2 r12 d2 d3 c11 l1 t1 d1 c3 cn1 c7 + r8 fb r13 r5 r16 out vcc r6 r2 r15 cs cpr r7 c4 u1 cpc bias gnd l2 r11 + c5 c6 r14 d4~d7 r3 r4 ap3768 r10 r9 q1 5v/700ma
low-power off-line primary side regulation controller ap3768 9 bcd semiconductor manufacturing limited aug. 2010 rev. 1. 0 preliminary datasheet mechanical dimensions mechanical dimensions unit: mm(inch) soic-8 0 8 1 5 r 0 . 1 5 0 ( 0 . 0 0 6 ) r0.150(0.006) 1.000(0.039) 0.330(0.013) 0.510(0.020) 1.350(0.053) 1.750(0.069) 0.100(0.004) 0.300(0.012) 0.900(0.035) 0.800(0.031) 0.200(0.008) 3.800(0.150) 4.000(0.157) 7 7 2 0 : 1 d 1.270(0.050) typ 0.190(0.007) 0.250(0.010) 8 d 5.800(0.228) 6.200(0.244) 0.675(0.027) 0.725(0.029) 0.320(0.013) 8 0.450(0.017) 0.800(0.031) 4.700(0.185) 5.100(0.201) note: eject hole, oriented hole and mold mark is optional.
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited


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